| 
Model
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– HBJC153I23-Q670B (Default) 
– HBJC153I23-Q670G4 (Expansion PCIe 4* Lan Card) system total up to 12* LAN ports 
– HBJC153I23-Q670B4 (Expansion PCIe 4* Bypass Lan Card) system total up to 12* LAN ports
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| 
MB Model
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– MI23-Q6700 (Q670E) 
– MI23-Q6702 (optional , Q670E,onboard TPM2.0)
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| 
CPU/Chipset
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– Intel® 12th/13th LGA1700 Socket Core i7/i5/i3/Pentium/Celeron Processor(Max. 65W TDPs under 180A) 
– Intel® Q670E Chipset
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| 
BIOS
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– AMI Flash ROM 
– Support recover crashed BIOS data tool by a USB flash pen driver: Using JetBIOS SW back up tool with any external USB ports
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| 
Memory
 | 
– 2* DDR5 4800MHz SO-DIMM up to 64GB
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| 
Network
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– 7* Intel® i225-V 2.5GbE 
– 1* Intel® i225-LM 2.5GbE
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| 
Graphics
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– Intel® UHD Graphics, shared memory 
– 1* HDMI (Max Resolution: 1920×1080@60Hz)
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| 
Storage
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– 1* M.2 M-key (2242/2280, PCIe Gen.4×4 w/SATA interface) 
– 1* M.2 M-key (2280, PCIe Gen.4×4 w/SATA interface) support NVMe 
– 2* 2.5” SATA HDD device support RAID 0, 1 (support 2.5” HDD with a height≦10mm)
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| 
Expansion
 | 
– 1* M.2 E-key (2230, USB2.0/PCIe x1) support CNVi 
– 1* M.2 B-key (3042, USB3.2 Gen.1/USB2.0/PCIe x1 interface) support 4G Module 
– 1* PCIe Gen.4×4 slot
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| 
Rear Panel I/O
 | 
– AC input CON 
– Power on/off SW
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| 
Front Panel I/O
 | 
– 8* RJ45 
– 2* USB3.2 (Gen.2) 
– 2* USB3.2 (Gen.1) 
– 1* COM (RS232) (Not installed when leaving the factory, the wires are placed in the parts box) 
– 1* HDMI (Not installed when leaving the factory, the wires are placed in the parts box) 
– 1* Alarm LED, 1* Power LED 
– Power on/off SW
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| 
Internal Connector
 | 
– SIM Card Holder
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| 
Power Source
 | 
– Power : 1U FLEX 300W POWER 
– MB : ATX Power Input (24pin ATX + 4pin 12V)
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| 
Compliance
 | 
– CE, FCC, LVD, RoHS, ErP Ready
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| 
Dimensions
 | 
– System: 430 (W) x 252 (D) x 44(H) mm 
– Box: 560 (W) x 400 (D) x 380 (H) mm
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| 
Temperature
 | 
– Operating Temperature: 0 ~ 50° C 
– Storage Temperature: -40 ~ 85° C 
– Humidity: 10%~95% @40° C (non-condensing)
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| 
OS Support
 | 
– Windows 11, Linux
 |